Collaborative innovation in China for next generation SoC and SiP solutions

April 21st, 2015.  Shanghai, China.  The National Center for Advanced Packaging Co., Ltd. (“NCAP China”), a company dedicated to developing and commercializing advanced packaging and system integration technologies, has joined with Brite Semiconductor, an emerging ASIC design services firm headquartered in Shanghai, China, to announce a research and development (R&D) collaboration targeting single and multi-die SoCs (Systems-on-Chip) and SiPs (System-in-Package).  Together they are partnering to develop innovative system packaging solutions, such as high performance flip-chip ball grid array (FCBGA) and high-density 3D packaging utilizing through-silicon via (TSV) technology for implementation in high performance products.  With a system-level focus on design for optimized IC integration within complex SiPs, the two parties intend to provide optimized solutions for SoCs used in today’s most demanding applications by end customers.

“As the IC industry continues to evolve, complexity increases and SoCs are required to meet the higher levels of system performance mandated by our customers for their end markets. In this China-based collaboration, we are dedicating our design experience targeting  advanced process technologies to an innovative R&D program with the NCAP team in order to provide optimized packaging solutions for SoCs incorporating high-performance interfaces such as SERDES and PCIE,” Said Dr. Charlie Zhi , CEO & President of Brite Semiconductor.  “This type of collaborative R&D is integral to the emergence of a “connected” China Supply Chain capable of servicing the global requirements of the world’s leading systems and fabless companies.”

“NCAP is equipped with a Wafer Level Packaging Line for processing both 200mm and 300mm wafers and is fully capable of TSV and other wafer level packaging technologies, as well as package assembly and test.  In the context of this R&D collaboration, we will be able to provide one-stop services from packaging design and simulation, advanced process development, to prototyping, testing, qualification, and new product introduction (NPI),” said Dr. Dongkai Shangguan, CEO of NCAP China. “In the ‘more than Moore’ era, partnering with leading IC design companies like Brite Semiconductor becomes a prerequisite to the advancement and competitiveness of the packaging industry where collaborative innovation across the supply chain is essential to customer success.”